banner_page

XPC850DEVR66BU

Microprocessor MPC8xx Series PC850 256-BBGA


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-XPC850DEVR66BU
  • Package: 256-BBGA
  • Datasheet: PDF
  • Stock: 284
  • Description: Microprocessor MPC8xx Series PC850 256-BBGA (Kg)

Details

Tags

Parameters
Package / Case 256-BBGA
Operating Temperature 0°C~95°C TA
Packaging Tray
Published 2004
Series MPC8xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PC850
Speed 66MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS Status ROHS3 Compliant

XPC850DEVR66BU Overview


The microprocessor is convenient for international shipping since it is packaged in 256-BBGA. High reliability is achieved using advanced packaging method Tray. CPUs have 1 Core 32-Bit cores/bus width. It is important to understand the operating temperature around 0°C~95°C TA. In the series MPC8xx, it is found. The CPU uses DRAM RAM controllers. This microprocessor is equipped with an interface of HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART. The CPU runs I/O at 3.3V. PC850 is a good way to search for variants of the microprocessor.

XPC850DEVR66BU Features



XPC850DEVR66BU Applications


There are a lot of NXP USA Inc. XPC850DEVR66BU Microprocessor applications.

  • Heater/Fan
  • Oil and gas
  • Kindle
  • DVD\DV\MP3 players
  • Digital cameras
  • Speed meter
  • Answering machines
  • Instrument control
  • Scanners
  • Day to day life field

Write a review

Note: HTML is not translated!
    Bad           Good