Parameters |
Package / Case |
256-BBGA |
Operating Temperature |
0°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
PC850 |
Speed |
66MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
USB |
USB 1.x (1) |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
ROHS3 Compliant |
XPC850DEVR66BU Overview
The microprocessor is convenient for international shipping since it is packaged in 256-BBGA. High reliability is achieved using advanced packaging method Tray. CPUs have 1 Core 32-Bit cores/bus width. It is important to understand the operating temperature around 0°C~95°C TA. In the series MPC8xx, it is found. The CPU uses DRAM RAM controllers. This microprocessor is equipped with an interface of HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART. The CPU runs I/O at 3.3V. PC850 is a good way to search for variants of the microprocessor.
XPC850DEVR66BU Features
XPC850DEVR66BU Applications
There are a lot of NXP USA Inc. XPC850DEVR66BU Microprocessor applications.
- Heater/Fan
- Oil and gas
- Kindle
- DVD\DV\MP3 players
- Digital cameras
- Speed meter
- Answering machines
- Instrument control
- Scanners
- Day to day life field