Parameters |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
PC850 |
Speed |
66MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
USB |
USB 1.x (1) |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
ROHS3 Compliant |
Package / Case |
256-BBGA |
Operating Temperature |
0°C~95°C TA |
Packaging |
Tape & Reel (TR) |
Published |
2004 |
Series |
MPC8xx |
XPC850DEVR66BUR2 Overview
The microprocessor is convenient for international shipping since it is packaged in 256-BBGA. High reliability is achieved by using advanced packaging methods Tape & Reel (TR). This CPU has 1 Core 32-Bit cores and 1 Core 32-Bit bus widths. Be aware of the operating temperature around 0°C~95°C TA. A MPC8xx series item. A CPU with this architecture uses DRAM RAM controllers. This microprocessor is equipped with an interface of HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART. I/O is run at 3.3V on this CPU. Use PC850 to search for variants of the cpu microprocessor.
XPC850DEVR66BUR2 Features
XPC850DEVR66BUR2 Applications
There are a lot of NXP USA Inc. XPC850DEVR66BUR2 Microprocessor applications.
- 3D printers
- Communication-bluetooth, Wi-Fi, radio
- Dishwashers
- Fire detection & safety devices
- Ipad
- Automobile
- Coffee machines
- Fax machines
- Auto-breaking system
- Washing machines