Parameters |
Package / Case |
256-BGA |
Operating Temperature |
0°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
PC850 |
Speed |
50MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
USB |
USB 1.x (1) |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
XPC850DEZT50BT Overview
Due to its 256-BGA packaging, it is convenient to ship overseas. High reliability is provided by the advanced packaging method Tray. In the CPU, there are 1 Core 32-Bit cores and 1 Core 32-Bit bus width. Extended operating temperature around 0°C~95°C TA. From the MPC8xx series. It has DRAM RAM controllers. This microprocessor features interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART. The CPU runs at 3.3V when it comes to I/O. You can search for variants of a microprocessor with PC850.
XPC850DEZT50BT Features
XPC850DEZT50BT Applications
There are a lot of NXP USA Inc. XPC850DEZT50BT Microprocessor applications.
- Fire alarms
- Temperature sensing and controlling devices
- Fire detection & safety devices
- Heart rate monitors
- Fax machines
- Computers and laptops-video calling, email, blogging
- Industrial instrumentation devices
- Hand-held metering systems
- Nintendo
- Medical instruments