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XPC850DEZT50BT

Microprocessor MPC8xx Series PC850 256-BGA


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-XPC850DEZT50BT
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 228
  • Description: Microprocessor MPC8xx Series PC850 256-BGA (Kg)

Details

Tags

Parameters
Package / Case 256-BGA
Operating Temperature 0°C~95°C TA
Packaging Tray
Published 2004
Series MPC8xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PC850
Speed 50MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS Status Non-RoHS Compliant

XPC850DEZT50BT Overview


Due to its 256-BGA packaging, it is convenient to ship overseas. High reliability is provided by the advanced packaging method Tray. In the CPU, there are 1 Core 32-Bit cores and 1 Core 32-Bit bus width. Extended operating temperature around 0°C~95°C TA. From the MPC8xx series. It has DRAM RAM controllers. This microprocessor features interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART. The CPU runs at 3.3V when it comes to I/O. You can search for variants of a microprocessor with PC850.

XPC850DEZT50BT Features



XPC850DEZT50BT Applications


There are a lot of NXP USA Inc. XPC850DEZT50BT Microprocessor applications.

  • Fire alarms
  • Temperature sensing and controlling devices
  • Fire detection & safety devices
  • Heart rate monitors
  • Fax machines
  • Computers and laptops-video calling, email, blogging
  • Industrial instrumentation devices
  • Hand-held metering systems
  • Nintendo
  • Medical instruments

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