Parameters |
Package / Case |
256-BGA |
Operating Temperature |
0°C~95°C TA |
Packaging |
Tape & Reel (TR) |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
PC850 |
Speed |
50MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
USB |
USB 1.x (1) |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
XPC850DEZT50BUR2 Overview
The embedded microprocessor has been packed in 256-BGA for convenient overseas shipping. In order to provide high reliability, advanced packaging method Tape & Reel (TR) is used. Cores/Bus width is 1 Core 32-Bit. Be aware of the operating temperature around 0°C~95°C TA. In the MPC8xx series, it is found. Memory controllers for this CPU are DRAM. Microprocessors with HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces are designed to serve users better. I/O is run at 3.3V on this CPU. Try searching for variants of the cpu microprocessor with PC850.
XPC850DEZT50BUR2 Features
XPC850DEZT50BUR2 Applications
There are a lot of NXP USA Inc. XPC850DEZT50BUR2 Microprocessor applications.
- Calculator
- Digital set-top boxes
- Dishwashers
- Virtual reality VR robots
- DDC control
- Process control devices
- Fire detection & safety devices
- Xbox
- Industrial control field
- Laminators