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XPC850DEZT50BUR2

Microprocessor MPC8xx Series PC850 256-BGA


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-XPC850DEZT50BUR2
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 286
  • Description: Microprocessor MPC8xx Series PC850 256-BGA (Kg)

Details

Tags

Parameters
Package / Case 256-BGA
Operating Temperature 0°C~95°C TA
Packaging Tape & Reel (TR)
Published 2004
Series MPC8xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PC850
Speed 50MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS Status Non-RoHS Compliant

XPC850DEZT50BUR2 Overview


The embedded microprocessor has been packed in 256-BGA for convenient overseas shipping. In order to provide high reliability, advanced packaging method Tape & Reel (TR) is used. Cores/Bus width is 1 Core 32-Bit. Be aware of the operating temperature around 0°C~95°C TA. In the MPC8xx series, it is found. Memory controllers for this CPU are DRAM. Microprocessors with HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces are designed to serve users better. I/O is run at 3.3V on this CPU. Try searching for variants of the cpu microprocessor with PC850.

XPC850DEZT50BUR2 Features



XPC850DEZT50BUR2 Applications


There are a lot of NXP USA Inc. XPC850DEZT50BUR2 Microprocessor applications.

  • Calculator
  • Digital set-top boxes
  • Dishwashers
  • Virtual reality VR robots
  • DDC control
  • Process control devices
  • Fire detection & safety devices
  • Xbox
  • Industrial control field
  • Laminators

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