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XPC850DEZT66BU

Microprocessor MPC8xx Series PC850 256-BGA


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-XPC850DEZT66BU
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 434
  • Description: Microprocessor MPC8xx Series PC850 256-BGA (Kg)

Details

Tags

Parameters
Package / Case 256-BGA
Operating Temperature 0°C~95°C TA
Packaging Tray
Published 2004
Series MPC8xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PC850
Speed 66MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS Status Non-RoHS Compliant

XPC850DEZT66BU Overview


Shipping overseas is convenient since the embedded microprocessor is packed in 256-BGA. Advanced packaging method Tray is used to provide high reliability. There are 1 Core 32-Bit cores per bus width on the CPU. Recognize operating temperatures around 0°C~95°C TA. MPC8xx is its series number. It has DRAM RAM controllers. This microprocessor features HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces to better serve its users. As far as I/O is concerned, this CPU runs at 3.3V. Using PC850 will help you find variants of the cpu microprocessor.

XPC850DEZT66BU Features



XPC850DEZT66BU Applications


There are a lot of NXP USA Inc. XPC850DEZT66BU Microprocessor applications.

  • Metering & measurement field
  • Kindle
  • Mice
  • Electromechanical control
  • Medical instruments
  • Fire alarms
  • Entertainment products
  • Printers
  • Removable disks
  • Measurement and control field

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