Parameters |
Package / Case |
256-BGA |
Operating Temperature |
0°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
PC850 |
Speed |
66MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
USB |
USB 1.x (1) |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
XPC850DEZT66BU Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 256-BGA. Advanced packaging method Tray is used to provide high reliability. There are 1 Core 32-Bit cores per bus width on the CPU. Recognize operating temperatures around 0°C~95°C TA. MPC8xx is its series number. It has DRAM RAM controllers. This microprocessor features HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces to better serve its users. As far as I/O is concerned, this CPU runs at 3.3V. Using PC850 will help you find variants of the cpu microprocessor.
XPC850DEZT66BU Features
XPC850DEZT66BU Applications
There are a lot of NXP USA Inc. XPC850DEZT66BU Microprocessor applications.
- Metering & measurement field
- Kindle
- Mice
- Electromechanical control
- Medical instruments
- Fire alarms
- Entertainment products
- Printers
- Removable disks
- Measurement and control field