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XPC850DEZT80BU

Microprocessor MPC8xx Series PC850 256-BGA


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-XPC850DEZT80BU
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 747
  • Description: Microprocessor MPC8xx Series PC850 256-BGA (Kg)

Details

Tags

Parameters
Co-Processors/DSP Communications; CPM
RoHS Status Non-RoHS Compliant
Package / Case 256-BGA
Operating Temperature 0°C~95°C TA
Packaging Tray
Published 2004
Series MPC8xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PC850
Speed 80MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART

XPC850DEZT80BU Overview


Due to its 256-BGA packaging, it is convenient to ship overseas. Advanced packaging method Tray is used to provide high reliability. The CPU has 1 Core 32-Bit cores/Bus width. Extended operating temperature around 0°C~95°C TA. It comes from the MPC8xx series. This CPU uses DRAM RAM controllers. This microprocessor features interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART. The CPU runs I/O at 3.3V. The microprocessor can be searched for with PC850 if you are looking for variants.

XPC850DEZT80BU Features



XPC850DEZT80BU Applications


There are a lot of NXP USA Inc. XPC850DEZT80BU Microprocessor applications.

  • Air fryers
  • Pacemakers (used to control abnormal heart rhythm)
  • Tape drives
  • Process control devices
  • Sonography (Ultrasound imaging)
  • Toasters
  • Communication-bluetooth, Wi-Fi, radio
  • Teletext terminals
  • Fire detection & safety devices
  • Automatic control

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