Parameters |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
Package / Case |
256-BGA |
Operating Temperature |
0°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
PC850 |
Speed |
80MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
USB |
USB 1.x (1) |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
XPC850DEZT80BU Overview
Due to its 256-BGA packaging, it is convenient to ship overseas. Advanced packaging method Tray is used to provide high reliability. The CPU has 1 Core 32-Bit cores/Bus width. Extended operating temperature around 0°C~95°C TA. It comes from the MPC8xx series. This CPU uses DRAM RAM controllers. This microprocessor features interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART. The CPU runs I/O at 3.3V. The microprocessor can be searched for with PC850 if you are looking for variants.
XPC850DEZT80BU Features
XPC850DEZT80BU Applications
There are a lot of NXP USA Inc. XPC850DEZT80BU Microprocessor applications.
- Air fryers
- Pacemakers (used to control abnormal heart rhythm)
- Tape drives
- Process control devices
- Sonography (Ultrasound imaging)
- Toasters
- Communication-bluetooth, Wi-Fi, radio
- Teletext terminals
- Fire detection & safety devices
- Automatic control