banner_page

XPC850DSLCZT50BU

Microprocessor MPC8xx Series PC850 256-BGA


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-XPC850DSLCZT50BU
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 664
  • Description: Microprocessor MPC8xx Series PC850 256-BGA (Kg)

Details

Tags

Parameters
Package / Case 256-BGA
Operating Temperature -40°C~95°C TA
Packaging Tray
Published 2004
Series MPC8xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PC850
Speed 50MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS Status Non-RoHS Compliant

XPC850DSLCZT50BU Overview


With a packing size of 256-BGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tray. Cores/Bus width of the CPU is 1 Core 32-Bit . Understand the operating temperature around -40°C~95°C TA. A MPC8xx series item. DRAM RAM controllers are used by this CPU. This microprocessor is equipped with an interface of HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART. At 3.3V, the CPU runs its I/O. Search PC850 for variants of the embedded microprocessor.

XPC850DSLCZT50BU Features



XPC850DSLCZT50BU Applications


There are a lot of NXP USA Inc. XPC850DSLCZT50BU Microprocessor applications.

  • Petrochemical
  • Washing machine
  • Printers
  • Instrument control
  • Food and beverage
  • Data acquisition and control
  • Torpedo guidance
  • Industrial robot
  • Automatic control
  • Industrial instrumentation devices

Write a review

Note: HTML is not translated!
    Bad           Good