Parameters |
Package / Case |
256-BGA |
Operating Temperature |
-40°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
PC850 |
Speed |
50MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
USB |
USB 1.x (1) |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
XPC850DSLCZT50BU Overview
With a packing size of 256-BGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved with advanced packaging method Tray. Cores/Bus width of the CPU is 1 Core 32-Bit . Understand the operating temperature around -40°C~95°C TA. A MPC8xx series item. DRAM RAM controllers are used by this CPU. This microprocessor is equipped with an interface of HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART. At 3.3V, the CPU runs its I/O. Search PC850 for variants of the embedded microprocessor.
XPC850DSLCZT50BU Features
XPC850DSLCZT50BU Applications
There are a lot of NXP USA Inc. XPC850DSLCZT50BU Microprocessor applications.
- Petrochemical
- Washing machine
- Printers
- Instrument control
- Food and beverage
- Data acquisition and control
- Torpedo guidance
- Industrial robot
- Automatic control
- Industrial instrumentation devices