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XPC850SRCZT50BU

Microprocessor MPC8xx Series PC850 256-BGA


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-XPC850SRCZT50BU
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 357
  • Description: Microprocessor MPC8xx Series PC850 256-BGA (Kg)

Details

Tags

Parameters
Package / Case 256-BGA
Operating Temperature -40°C~95°C TA
Packaging Tray
Published 2004
Series MPC8xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PC850
Speed 50MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS Status Non-RoHS Compliant

XPC850SRCZT50BU Overview


With a packing size of 256-BGA, this embedded microprocessor is ideal for international shipping. In order to provide high reliability, advanced packaging method Tray is used. The CPU has 1 Core 32-Bit cores/Bus width. Understand how the operating temperature around -40°C~95°C TA is determined. The MPC8xx series contains it. There are DRAM RAM controllers used by this CPU. To serve better this microprocessor features HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces. There is 3.3V I/O running on this CPU. PC850 is a good way to search for variants of the microprocessor.

XPC850SRCZT50BU Features



XPC850SRCZT50BU Applications


There are a lot of NXP USA Inc. XPC850SRCZT50BU Microprocessor applications.

  • Industrial robot
  • Plant factories (special plant factories, soilless cultivation technology, smart seed engineering)
  • DCS control intelligent sensor
  • Printers
  • Heart rate monitors
  • Smartphones-calling, video calling, texting, email
  • Smartphone
  • Playstation
  • Laminators
  • Washing machines

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