Parameters |
Package / Case |
256-BGA |
Operating Temperature |
-40°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
PC850 |
Speed |
50MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
USB |
USB 1.x (1) |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
XPC850SRCZT50BU Overview
With a packing size of 256-BGA, this embedded microprocessor is ideal for international shipping. In order to provide high reliability, advanced packaging method Tray is used. The CPU has 1 Core 32-Bit cores/Bus width. Understand how the operating temperature around -40°C~95°C TA is determined. The MPC8xx series contains it. There are DRAM RAM controllers used by this CPU. To serve better this microprocessor features HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces. There is 3.3V I/O running on this CPU. PC850 is a good way to search for variants of the microprocessor.
XPC850SRCZT50BU Features
XPC850SRCZT50BU Applications
There are a lot of NXP USA Inc. XPC850SRCZT50BU Microprocessor applications.
- Industrial robot
- Plant factories (special plant factories, soilless cultivation technology, smart seed engineering)
- DCS control intelligent sensor
- Printers
- Heart rate monitors
- Smartphones-calling, video calling, texting, email
- Smartphone
- Playstation
- Laminators
- Washing machines