Parameters |
Package / Case |
256-BBGA |
Operating Temperature |
0°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
PC850 |
Speed |
80MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
USB |
USB 1.x (1) |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
ROHS3 Compliant |
XPC850SRVR80BU Overview
With a packing size of 256-BBGA, this embedded microprocessor is ideal for international shipping. High reliability is provided by the advanced packaging method Tray. The CPU has 1 Core 32-Bit cores/Bus width. It is important to understand the operating temperature around 0°C~95°C TA. This is part of the MPC8xx series. A CPU with this architecture uses DRAM RAM controllers. Microprocessors with HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces are designed to serve users better. As far as I/O is concerned, this CPU runs at 3.3V. You can search for variants of a microprocessor with PC850.
XPC850SRVR80BU Features
XPC850SRVR80BU Applications
There are a lot of NXP USA Inc. XPC850SRVR80BU Microprocessor applications.
- Answering machines
- Television
- Automatic staplers
- Industrial control field
- Dryers
- Keyboards
- Monitoring-temperature level, oil level, speed, distance, acceleration
- Medical instruments
- Refrigerators
- Home video and audio