Parameters |
Package / Case |
256-BGA |
Operating Temperature |
0°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
PC850 |
Speed |
50MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
USB |
USB 1.x (1) |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
XPC850SRZT50BU Overview
Shipping overseas is convenient since the embedded microprocessor is packed in 256-BGA. High reliability is achieved with advanced packaging method Tray. This CPU has 1 Core 32-Bit cores and 1 Core 32-Bit bus widths. Recognize operating temperatures around 0°C~95°C TA. In the series MPC8xx, it is found. A total of DRAM RAM controllers are used by this CPU. This microprocessor is equipped with an interface of HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART. In this CPU, I/O is set to 3.3V. Search PC850 for variants of the embedded microprocessor.
XPC850SRZT50BU Features
XPC850SRZT50BU Applications
There are a lot of NXP USA Inc. XPC850SRZT50BU Microprocessor applications.
- Washing machine
- Toasters
- Industrial robot
- Microwave ovens
- Guidance-GPS
- Computed Tomography (CT scan)
- Industrial instrumentation devices
- Hard drives
- Fire alarms
- Set-top boxes