Parameters |
Package / Case |
256-BGA |
Operating Temperature |
0°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
PC850 |
Speed |
66MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
USB |
USB 1.x (1) |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
XPC850SRZT66BU Overview
The microprocessor is convenient for international shipping since it is packaged in 256-BGA. High reliability can be achieved by using the advanced packaging method Tray. There are 1 Core 32-Bit cores/bus width on the CPU. Obtain a basic understanding of operating temperature around 0°C. A MPC8xx series item. DRAM RAM controllers are used by this CPU. Microprocessors with HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces are designed to serve users better. The CPU runs I/O at 3.3V. You can search for variants of a microprocessor with PC850.
XPC850SRZT66BU Features
XPC850SRZT66BU Applications
There are a lot of NXP USA Inc. XPC850SRZT66BU Microprocessor applications.
- Projectors
- Office automation equipment and computer peripherals
- Agriculture, transportation field
- Copiers
- Robots
- Monitoring-temperature level, oil level, speed, distance, acceleration
- Fax machines
- Metering & measurement field
- Network communication, mobile communication field
- Fire alarms