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XPC850SRZT66BU

Microprocessor MPC8xx Series PC850 256-BGA


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-XPC850SRZT66BU
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 721
  • Description: Microprocessor MPC8xx Series PC850 256-BGA (Kg)

Details

Tags

Parameters
Package / Case 256-BGA
Operating Temperature 0°C~95°C TA
Packaging Tray
Published 2004
Series MPC8xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PC850
Speed 66MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS Status Non-RoHS Compliant

XPC850SRZT66BU Overview


The microprocessor is convenient for international shipping since it is packaged in 256-BGA. High reliability can be achieved by using the advanced packaging method Tray. There are 1 Core 32-Bit cores/bus width on the CPU. Obtain a basic understanding of operating temperature around 0°C. A MPC8xx series item. DRAM RAM controllers are used by this CPU. Microprocessors with HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces are designed to serve users better. The CPU runs I/O at 3.3V. You can search for variants of a microprocessor with PC850.

XPC850SRZT66BU Features



XPC850SRZT66BU Applications


There are a lot of NXP USA Inc. XPC850SRZT66BU Microprocessor applications.

  • Projectors
  • Office automation equipment and computer peripherals
  • Agriculture, transportation field
  • Copiers
  • Robots
  • Monitoring-temperature level, oil level, speed, distance, acceleration
  • Fax machines
  • Metering & measurement field
  • Network communication, mobile communication field
  • Fire alarms

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