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XPC850SRZT80BU

Microprocessor MPC8xx Series PC850 256-BGA


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-XPC850SRZT80BU
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 633
  • Description: Microprocessor MPC8xx Series PC850 256-BGA (Kg)

Details

Tags

Parameters
Package / Case 256-BGA
Operating Temperature 0°C~95°C TA
Packaging Tray
Published 2004
Series MPC8xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PC850
Speed 80MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS Status Non-RoHS Compliant

XPC850SRZT80BU Overview


With a packing size of 256-BGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved using advanced packaging method Tray. A CPU with 1 Core 32-Bit cores and width 1 Core 32-Bit busses is used. It is important to understand the operating temperature around 0°C~95°C TA. MPC8xx is its series number. It has DRAM RAM controllers. This microprocessor features HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces to better serve its users. At 3.3V, the CPU runs its I/O. Use PC850 to search for variants of the cpu microprocessor.

XPC850SRZT80BU Features



XPC850SRZT80BU Applications


There are a lot of NXP USA Inc. XPC850SRZT80BU Microprocessor applications.

  • Process control devices
  • Medical instruments
  • Automatic staplers
  • Smart instruments
  • Missile control
  • Graphic terminals
  • Instrument control
  • Industrial instrumentation devices
  • Toasters
  • Washing machine

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