Parameters |
Package / Case |
256-BGA |
Operating Temperature |
0°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
PC850 |
Speed |
80MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
USB |
USB 1.x (1) |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
XPC850SRZT80BU Overview
With a packing size of 256-BGA, this embedded microprocessor is ideal for international shipping. High reliability is achieved using advanced packaging method Tray. A CPU with 1 Core 32-Bit cores and width 1 Core 32-Bit busses is used. It is important to understand the operating temperature around 0°C~95°C TA. MPC8xx is its series number. It has DRAM RAM controllers. This microprocessor features HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces to better serve its users. At 3.3V, the CPU runs its I/O. Use PC850 to search for variants of the cpu microprocessor.
XPC850SRZT80BU Features
XPC850SRZT80BU Applications
There are a lot of NXP USA Inc. XPC850SRZT80BU Microprocessor applications.
- Process control devices
- Medical instruments
- Automatic staplers
- Smart instruments
- Missile control
- Graphic terminals
- Instrument control
- Industrial instrumentation devices
- Toasters
- Washing machine