Parameters |
Package / Case |
256-BGA |
Operating Temperature |
0°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
PC850 |
Speed |
50MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
USB |
USB 1.x (1) |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
XPC850ZT50BU Overview
The embedded microprocessor has been packed in 256-BGA for convenient overseas shipping. High reliability is achieved by using advanced packaging methods Tray. A CPU with 1 Core 32-Bit cores and width 1 Core 32-Bit busses is used. The operating temperature around 0°C~95°C TA should be understood. The MPC8xx series contains it. A total of DRAM RAM controllers are used by this CPU. To serve better this microprocessor features HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces. There is 3.3V I/O running on this CPU. The microprocessor can be searched for with PC850 if you are looking for variants.
XPC850ZT50BU Features
XPC850ZT50BU Applications
There are a lot of NXP USA Inc. XPC850ZT50BU Microprocessor applications.
- PDAs, game consoles
- Traditional industrial transformation
- Leakage current tester
- Mice
- Embedded gateways
- Automatic control
- Graphic terminals
- Smart instruments
- Home video and audio
- Aerospace navigation systems