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XPC850ZT50BU

Microprocessor MPC8xx Series PC850 256-BGA


  • Manufacturer: NXP USA Inc.
  • Nocochips NO: 568-XPC850ZT50BU
  • Package: 256-BGA
  • Datasheet: PDF
  • Stock: 366
  • Description: Microprocessor MPC8xx Series PC850 256-BGA (Kg)

Details

Tags

Parameters
Package / Case 256-BGA
Operating Temperature 0°C~95°C TA
Packaging Tray
Published 2004
Series MPC8xx
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Base Part Number PC850
Speed 50MHz
Voltage - I/O 3.3V
Ethernet 10Mbps (1)
Number of Cores/Bus Width 1 Core 32-Bit
Graphics Acceleration No
RAM Controllers DRAM
USB USB 1.x (1)
Additional Interfaces HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART
Co-Processors/DSP Communications; CPM
RoHS Status Non-RoHS Compliant

XPC850ZT50BU Overview


The embedded microprocessor has been packed in 256-BGA for convenient overseas shipping. High reliability is achieved by using advanced packaging methods Tray. A CPU with 1 Core 32-Bit cores and width 1 Core 32-Bit busses is used. The operating temperature around 0°C~95°C TA should be understood. The MPC8xx series contains it. A total of DRAM RAM controllers are used by this CPU. To serve better this microprocessor features HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interfaces. There is 3.3V I/O running on this CPU. The microprocessor can be searched for with PC850 if you are looking for variants.

XPC850ZT50BU Features



XPC850ZT50BU Applications


There are a lot of NXP USA Inc. XPC850ZT50BU Microprocessor applications.

  • PDAs, game consoles
  • Traditional industrial transformation
  • Leakage current tester
  • Mice
  • Embedded gateways
  • Automatic control
  • Graphic terminals
  • Smart instruments
  • Home video and audio
  • Aerospace navigation systems

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