Parameters |
Package / Case |
256-BGA |
Operating Temperature |
0°C~95°C TA |
Packaging |
Tray |
Published |
2004 |
Series |
MPC8xx |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Base Part Number |
PC850 |
Speed |
66MHz |
Voltage - I/O |
3.3V |
Ethernet |
10Mbps (1) |
Number of Cores/Bus Width |
1 Core 32-Bit |
Graphics Acceleration |
No |
RAM Controllers |
DRAM |
USB |
USB 1.x (1) |
Additional Interfaces |
HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART |
Co-Processors/DSP |
Communications; CPM |
RoHS Status |
Non-RoHS Compliant |
XPC850ZT66BU Overview
The embedded microprocessor ships overseas conveniently packed in 256-BGA. High reliability is achieved with advanced packaging method Tray. The CPU has 1 Core 32-Bit cores/Bus width. Be aware of the operating temperature around 0°C~95°C TA. In the series MPC8xx, it is found. There are DRAM RAM controllers used by this CPU. A HDLC/SDLC, I2C, IrDA, PCMCIA-ATA, TDM, UART/USART interface has been added to this microprocessor in order to serve the user better. This CPU runs I/O at 3.3V. To find variants of the microprocessor, try searching with PC850.
XPC850ZT66BU Features
XPC850ZT66BU Applications
There are a lot of NXP USA Inc. XPC850ZT66BU Microprocessor applications.
- Teletext terminals
- Graphic terminals
- Tape drives
- Process control devices
- Industrial robot
- Ipad
- Removable disks
- Communication-bluetooth, Wi-Fi, radio
- Hand-held metering systems
- Pacemakers (used to control abnormal heart rhythm)