Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Through Hole |
Mounting Type | Through Hole |
Housing Material | Polybutylene Terephthalate (PBT), Glass Filled |
Number of Positions or Pins (Grid) | 40 (2 x 20) |
Contact Material - Mating | Beryllium Copper |
Contact Material - Post | Beryllium Copper |
Operating Temperature | -55°C~125°C |
Packaging | Bulk |
Published | 2002 |
Series | XR2 |
JESD-609 Code | e4 |
Feature | Open Frame |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Termination | Solder |
ECCN Code | EAR99 |
Type | DIP, 0.6 (15.24mm) Row Spacing |
Number of Rows | 2 |
Contact Finish - Mating | Gold |
Orientation | Straight |
Pitch - Mating | 0.100 2.54mm |
Number of Contacts | 40 |
Contact Resistance | 20mOhm |
Max Voltage Rating (AC) | 300V |
Max Current Rating | 1A |
Termination Post Length | 0.126 3.20mm |
Pitch - Post | 0.100 2.54mm |
Contact Finish Thickness - Mating | 30.0μin 0.76μm |
Contact Finish Thickness - Post | 30.0μin 0.76μm |
Material Flammability Rating | UL94 V-0 |
Radiation Hardening | No |
RoHS Status | RoHS Compliant |