XRT73R06IB
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 217-BBGA |
| Operating Temperature | -40°C~85°C |
| Packaging | Tray |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Voltage - Supply | 3.135V~3.465V |
| Function | Line Interface Unit (LIU) |
| Interface | LIU |
| Number of Circuits | 6 |
| Current - Supply | 725mA |
XRT73R06IB Overview
A 217-BBGA package saves space on a board.A Tray-packing method is used to pack telecommunications equipment.Surface Mount is used as telecommunications equipment mounting type.There are 6 circuits in this telecom IC .The supply voltage of 3.135V~3.465V can increase efficiency.At -40°C~85°C, reliable performance can be achieved.There is a supply current of 725mA for telecom equipment to operate on.
XRT73R06IB Features
Available in the 217-BBGA package
XRT73R06IB Applications
There are a lot of MaxLinear, Inc. XRT73R06IB Telecom applications.
- Remote wireless modules
- Digital Modems
- Digital Access Cross-connect System (DACs)
- Integrated Access Devices (IADs)
- SDH Multiplexers
- Voice over IP/DSL
- T2 Rates PCM Line Interface
- E2 Rates PCM Line Interface
- Frame Relay Switches and Access Devices (FRADS)
- Wireless base stations
