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XRT75L03DIVTR-F

Telecom device3 Circuits


  • Manufacturer: MaxLinear, Inc.
  • Nocochips NO: 493-XRT75L03DIVTR-F
  • Package: 128-LQFP Exposed Pad
  • Datasheet: PDF
  • Stock: 898
  • Description: Telecom device3 Circuits(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 128-LQFP Exposed Pad
Operating Temperature -40°C~85°C
Packaging Tape & Reel (TR)
Part Status Discontinued
Moisture Sensitivity Level (MSL) 2A (4 Weeks)
Voltage - Supply 3.135V~3.465V
Function Line Interface Unit (LIU)
Interface LIU
Number of Circuits 3
Current - Supply 480mA
RoHS Status RoHS Compliant

XRT75L03DIVTR-F Overview


Board space can be saved by using the 128-LQFP Exposed Pad package.For telecommunications equipment packing, the Tape & Reel (TR) method is used.A Surface Mount mounting type is used.Telecommunications equipment consists of 3 circuits.3.135V~3.465V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.A temperature setting of -40°C~85°C ensures reliable performance.480mA is the supply current.

XRT75L03DIVTR-F Features


Available in the 128-LQFP Exposed Pad package

XRT75L03DIVTR-F Applications


There are a lot of MaxLinear, Inc. XRT75L03DIVTR-F Telecom applications.

  • Intelligent PBX
  • Inverse Multiplexing for ATM (IMA) Wireless Base Stations
  • Set-Top Box
  • Multichannel DS1 Test Equipment
  • ISDN Primary Rate Interface
  • DECT (Digital European Cordless Telephone) Base
  • Channel Banks
  • PCM channel bank
  • ISDN NT1/TA
  • T3 channelized access concentrators

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