XRT75L06DIB-F
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 217-BBGA |
| Operating Temperature | -40°C~85°C |
| Packaging | Tray |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Voltage - Supply | 3.135V~3.465V |
| Function | Line Interface Unit (LIU) |
| Interface | Logic |
| Number of Circuits | 6 |
XRT75L06DIB-F Overview
A 217-BBGA package saves space on a board.The way of Tray is employed for telecommunications equipment packing.In this case, Surface Mount is the mounting type.Telecom circuit is made up of 6 circuits.Improved efficiency can be ensured when the supply voltage of 3.135V~3.465V is provided.Reliable performance can be offered when the operating temperature is set at -40°C~85°C.
XRT75L06DIB-F Features
Available in the 217-BBGA package
XRT75L06DIB-F Applications
There are a lot of MaxLinear, Inc. XRT75L06DIB-F Telecom applications.
- Digital cross connects (DSX-1)
- E1 Network Equipment
- SONET/SDH terminal
- Central office
- Channel Service Units (CSUs): T1/E1/J1
- Multi-Line E1 Interface Cards
- Central office (CO)
- T2 Rates PCM Line Interface
- Multichannel DS1 Test Equipment
- Intelligent PBX
