XRT75L06IB-F
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 217-BBGA |
| Operating Temperature | -40°C~85°C |
| Packaging | Tray |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Voltage - Supply | 3.135V~3.465V |
| Function | Line Interface Unit (LIU) |
| Interface | LIU |
| Number of Circuits | 6 |
XRT75L06IB-F Overview
Space is saved on the board by using the 217-BBGA package.Telecommunications equipment is packed using the Tray method.Telecommunications equipment is mounted using Surface Mount.Telecommunications equipment consists of 6 circuits.Wtelecom IC's efficiencyh a high supply voltage, 3.135V~3.465V can be operated more efficiently.The operating temperature set at -40°C~85°C can offer reliable performance.
XRT75L06IB-F Features
Available in the 217-BBGA package
XRT75L06IB-F Applications
There are a lot of MaxLinear, Inc. XRT75L06IB-F Telecom applications.
- SDH Multiplexers
- PBXs channel bank
- Integrated Access Devices
- PBX interfaces
- PBX (Private Branch Exchange)
- Set-Top Box
- CSU/DSU Equipment
- E1 Network Equipment
- Central office
- ISDN NT1/TA
