banner_page

XRT75R03DIV-F

Telecom device3 Circuits


  • Manufacturer: MaxLinear, Inc.
  • Nocochips NO: 493-XRT75R03DIV-F
  • Package: 128-LQFP
  • Datasheet: PDF
  • Stock: 611
  • Description: Telecom device3 Circuits(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 128-LQFP
Operating Temperature -40°C~85°C
Packaging Tray
Part Status Obsolete
Moisture Sensitivity Level (MSL) 2A (4 Weeks)
Voltage - Supply 3.135V~3.465V
Function Line Interface Unit (LIU)
Interface LIU
Number of Circuits 3
Current - Supply 410mA

XRT75R03DIV-F Overview


The 128-LQFP package reduces the amount of space on a board.To pack telecommunications equipment, the way of Tray is used.The mounting type of this telecom circuit is Surface Mount.The telecom IC is composed of 3 circuits.When 3.135V~3.465V is supplied wtelecom IC's efficiencyh power, efficiency can be improved.A temperature setting of -40°C~85°C ensures reliable performance.A 410mA-volt supply current is used to operate telecom equipment .

XRT75R03DIV-F Features


Available in the 128-LQFP package

XRT75R03DIV-F Applications


There are a lot of MaxLinear, Inc. XRT75R03DIV-F Telecom applications.

  • Cross Connects
  • Integrated Access Devices (IADs)
  • Router
  • Routers
  • T1/E1/J1 add/drop multiplexers (MUX)
  • E1 LAN/WAN Routers
  • Cable Telephony
  • E1 Network Equipment
  • Multichannel DS1 Test Equipment
  • T1/E1/J1 Performance Monitoring

Write a review

Note: HTML is not translated!
    Bad           Good