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XRT75R06DIB-F

Telecom device6 Circuits


  • Manufacturer: MaxLinear, Inc.
  • Nocochips NO: 493-XRT75R06DIB-F
  • Package: 217-BBGA
  • Datasheet: PDF
  • Stock: 647
  • Description: Telecom device6 Circuits(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 217-BBGA
Operating Temperature -40°C~85°C
Packaging Tray
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Voltage - Supply 3.135V~3.465V
Function Line Interface Unit (LIU)
Interface LIU
Number of Circuits 6
Current - Supply 725mA
RoHS Status RoHS Compliant

XRT75R06DIB-F Overview


Saving board space is achieved with the 217-BBGA package.In order to pack telecommunications equipment, Tray is used.Mounting type Surface Mount is used.The telecom IC is composed of 6 circuits.Telecom circuit is possible to increase efficiency by providing 3.135V~3.465V with a higher voltage.At -40°C~85°C, reliable performance can be achieved.There is a supply current of 725mA for telecom equipment to operate on.

XRT75R06DIB-F Features


Available in the 217-BBGA package

XRT75R06DIB-F Applications


There are a lot of MaxLinear, Inc. XRT75R06DIB-F Telecom applications.

  • Fiber in the loop (FITL)
  • Digital cross connects (DSX-1)
  • SONET/SDH terminal
  • SDH/SONET multiplexers
  • Router
  • ISDN Primary Rate Interfaces (PRA)
  • E2 Rates PCM Line Interface
  • Digital Cross Connect Systems
  • Fiber In The Loop (FITL)
  • Multi-Line E1 Interface Cards

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