XRT75R06IB-F
| Parameters | |
|---|---|
| Current - Supply | 725mA |
| Mounting Type | Surface Mount |
| Package / Case | 217-BBGA |
| Operating Temperature | -40°C~85°C |
| Packaging | Tray |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Voltage - Supply | 3.135V~3.465V |
| Function | Line Interface Unit (LIU) |
| Interface | LIU |
| Number of Circuits | 6 |
XRT75R06IB-F Overview
Space is saved on the board by using the 217-BBGA package.Telecommunications equipment is packed using the Tray method.A Surface Mount-mount is used for mounting the telecom circuit.6 circuits make up this telecom IC .Improved efficiency can be ensured when the supply voltage of 3.135V~3.465V is provided.Operating temperatures of -40°C~85°C can ensure reliable performance.A 725mA supply current is required to operate telecom equipment .
XRT75R06IB-F Features
Available in the 217-BBGA package
XRT75R06IB-F Applications
There are a lot of MaxLinear, Inc. XRT75R06IB-F Telecom applications.
- Central office
- Cable PC
- Routers
- T3 channelized access concentrators
- SDH Multiplexers
- ISDN Primary Rate Interface
- Channel Banks
- High speed data transmission line cards
- Wireless base stations
- High-Density T1/E1/J1 interfaces for Multiplexers
