XRT83SH314IB-F
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 304-BBGA |
| Supplier Device Package | 304-PBGA (31x31) |
| Operating Temperature | -40°C~85°C |
| Packaging | Tray |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Voltage - Supply | 3.135V~3.465V |
| Function | Line Interface Unit (LIU) |
| Interface | LIU |
| Number of Circuits | 14 |
XRT83SH314IB-F Overview
Board space can be saved by using the 304-BBGA package.Packing is done according to the Tray method.The mounting type of this telecom circuit is Surface Mount.Telecom circuit is made up of 14 circuits.Telecom circuit is possible to increase efficiency by providing 3.135V~3.465V with a higher voltage.-40°C~85°C is a temperature setting that is reliable when telecom switching comes to performance.
XRT83SH314IB-F Features
Available in the 304-BBGA package
XRT83SH314IB-F Applications
There are a lot of MaxLinear, Inc. XRT83SH314IB-F Telecom applications.
- T1 Digital Cross Connects (DSX-1)
- Digital access cross connects
- Digital loop carrier (DLC)
- Central office (CO)
- Remote wireless modules
- NIU
- Interfaces to DS3
- E1 LAN/WAN Routers
- Voice over IP/DSL
- ATM Switches
