XRT83SH38IB
| Parameters | |
|---|---|
| Mounting Type | Surface Mount |
| Package / Case | 225-BGA |
| Operating Temperature | -40°C~85°C |
| Packaging | Tray |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
| Voltage - Supply | 3.135V~3.465V |
| Function | Line Interface Unit (LIU) |
| Interface | LIU |
| Number of Circuits | 8 |
XRT83SH38IB Overview
Board space can be saved by using the 225-BGA package.For telecommunications equipment packing, the Tray method is used.The mounting type of this telecom circuit is Surface Mount.Telecom circuit is made up of 8 circuits.3.135V~3.465V can be supplied wtelecom IC's efficiencyh a voltage that enhances efficiency.Telecom switching is possible to achieve reliable performance when the operating temperature is set at -40°C~85°C.
XRT83SH38IB Features
Available in the 225-BGA package
XRT83SH38IB Applications
There are a lot of MaxLinear, Inc. XRT83SH38IB Telecom applications.
- Cable Modem
- T1 Digital Cross Connects (DSX-1)
- Central office
- SONET/SDH terminal
- Digital Cross-connect Systems (DCS)
- Network Multiplexing and Terminating Equipment
- CSU/DSU E1 Interface
- Inverse Multiplexing for ATM (IMA) Wireless Base Stations
- Cross Connects
- Fiber In The Loop (FITL)
