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XRT83VSH28ES

Telecom device8 Circuits


  • Manufacturer: MaxLinear, Inc.
  • Nocochips NO: 493-XRT83VSH28ES
  • Package: 225-BGA
  • Datasheet: -
  • Stock: 650
  • Description: Telecom device8 Circuits(Kg)

Details

Tags

Parameters
Factory Lead Time 1 Week
Mounting Type Surface Mount
Package / Case 225-BGA
Supplier Device Package 225-BGA (19x19)
Packaging Bulk
Part Status Active
Moisture Sensitivity Level (MSL) 4 (72 Hours)
Voltage - Supply 3.14V~3.47V
Function Line Interface Unit (LIU)
Interface LIU
Number of Circuits 8
RoHS Status RoHS Compliant

XRT83VSH28ES Overview


A 225-BGA package is used to reduce board space requirements.A Bulk-packing method is used to pack telecommunications equipment.Surface Mount is used as telecommunications equipment mounting type.There are 8 circuits in this telecom IC .Telecom circuit is possible to increase efficiency by providing 3.14V~3.47V with a higher voltage.

XRT83VSH28ES Features


Available in the 225-BGA package

XRT83VSH28ES Applications


There are a lot of MaxLinear, Inc. XRT83VSH28ES Telecom applications.

  • Home Side Box
  • ATM Switches
  • Channel Service Units (CSUs): T1/E1/J1
  • T1 Digital Cross Connects (DSX-1)
  • High-Density T1/E1/J1 interfaces for Multiplexers
  • Digital access cross connects
  • Switching Systems
  • Hybrid fiber coax (HFC)
  • Inverse Multiplexing for ATM (IMA)
  • E2 Rates PCM Line Interface

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