Parameters | |
---|---|
Mounting Type | Surface Mount |
Package / Case | 225-BGA |
Surface Mount | YES |
Operating Temperature | -40°C~85°C |
Packaging | Tray |
JESD-609 Code | e1 |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 4 (72 Hours) |
Number of Terminations | 225 |
Terminal Finish | TIN SILVER COPPER |
Voltage - Supply | 3.14V~3.47V |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | NOT SPECIFIED |
Supply Voltage | 3.3V |
Terminal Pitch | 1mm |
Time@Peak Reflow Temperature-Max (s) | NOT SPECIFIED |
JESD-30 Code | S-PBGA-B225 |
Function | Line Interface Unit (LIU) |
Number of Circuits | 8 |
Telecom IC Type | PCM TRANSCEIVER |
Height Seated (Max) | 2.1mm |
Length | 19mm |
Width | 19mm |
RoHS Status | RoHS Compliant |