Parameters |
Mount |
Surface Mount |
Package / Case |
TSSOP |
Packaging |
Tape & Reel (TR) |
Max Operating Temperature |
85°C |
Min Operating Temperature |
-40°C |
Number of Circuits |
1 |
Logic Function |
Clock |
RoHS Status |
RoHS Compliant |
XRT85L61IGTR-F Overview
Saving board space is achieved with the TSSOP package.Telecommunications equipment is packed using the Tape & Reel (TR) method.1 circuits are used in this telecom IC .Mounted in Surface Mount-direction.Temperature should be set at the minimum value of -40°C to ensure normal operation.Ensure normal operation by setting the temperature to the maximum value of 85°C.
XRT85L61IGTR-F Features
Available in the TSSOP package
XRT85L61IGTR-F Applications
There are a lot of Exar Corporation XRT85L61IGTR-F Telecom applications.
- Hybrid fiber coax (HFC)
- Public switching systems
- Cable modem
- Channel Banks
- Interfaces to E3
- Channel Banks
- Switching Systems
- Home Side Box
- T3 channelized access concentrators
- E1 Rates PCM Line Interface