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XRT85L61IGTR-F

Telecom device1 Circuits


  • Manufacturer: Exar Corporation
  • Nocochips NO: 3417-XRT85L61IGTR-F
  • Package: TSSOP
  • Datasheet: -
  • Stock: 169
  • Description: Telecom device1 Circuits(Kg)

Details

Tags

Parameters
Mount Surface Mount
Package / Case TSSOP
Packaging Tape & Reel (TR)
Max Operating Temperature 85°C
Min Operating Temperature -40°C
Number of Circuits 1
Logic Function Clock
RoHS Status RoHS Compliant

XRT85L61IGTR-F Overview


Saving board space is achieved with the TSSOP package.Telecommunications equipment is packed using the Tape & Reel (TR) method.1 circuits are used in this telecom IC .Mounted in Surface Mount-direction.Temperature should be set at the minimum value of -40°C to ensure normal operation.Ensure normal operation by setting the temperature to the maximum value of 85°C.

XRT85L61IGTR-F Features


Available in the TSSOP package

XRT85L61IGTR-F Applications


There are a lot of Exar Corporation XRT85L61IGTR-F Telecom applications.

  • Hybrid fiber coax (HFC)
  • Public switching systems
  • Cable modem
  • Channel Banks
  • Interfaces to E3
  • Channel Banks
  • Switching Systems
  • Home Side Box
  • T3 channelized access concentrators
  • E1 Rates PCM Line Interface

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