XS170
| Parameters | |
|---|---|
| Mount | Through Hole |
| Mounting Type | Through Hole |
| Package / Case | 8-DIP (0.300, 7.62mm) |
| Number of Pins | 8 |
| Supplier Device Package | 8-DIP |
| Operating Temperature | -40°C~85°C |
| Packaging | Tube |
| Published | 2001 |
| Part Status | Obsolete |
| Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
| Max Operating Temperature | 85°C |
| Min Operating Temperature | -40°C |
| Power (Watts) | 800mW |
| Max Power Dissipation | 800mW |
| Function | Relay Switch |
| Number of Circuits | 2 |
| Throw Configuration | SPST |
| Input Current | 50mA |
| RoHS Status | RoHS Compliant |
| Lead Free | Lead Free |
XS170 Overview
The 8-DIP (0.300, 7.62mm) package reduces the amount of space on a board.The way of Tube is employed for telecommunications equipment packing.Telecommunications equipment is mounted using Through Hole.Telecom circuit is made up of 2 circuits.-40°C~85°C is a temperature setting that is reliable when telecom switching comes to performance.Through Hole is mounted on telecom switching.8 pins are located on this telecom interface.During normal operation, a minimum value of -40°C is set for the temperature.Normal operation is ensured by setting 85°C to the maximum value.
XS170 Features
Available in the 8-DIP (0.300, 7.62mm) package
XS170 Applications
There are a lot of IXYS Integrated Circuits Division XS170 Telecom applications.
- T1/E1/J1 LAN/WAN Routers
- Switches
- ISDN NT1/TA
- ISDN terminal adapter
- E3/DS3 Access Equipment
- T1/E1/J1 Multiplexer and Channel Banks
- Voice over IP/DSL
- Residential Gateways
- PBXs channel bank
- E1 LAN/WAN Routers
