Parameters |
Mounting Type |
Surface Mount |
Package / Case |
552-BGA |
Surface Mount |
YES |
Operating Temperature |
-40°C~85°C |
Packaging |
Tray |
Published |
2009 |
JESD-609 Code |
e0 |
Pbfree Code |
no |
Part Status |
Obsolete |
Moisture Sensitivity Level (MSL) |
3 (168 Hours) |
Number of Terminations |
552 |
Terminal Finish |
TIN LEAD |
Subcategory |
Other Telecom ICs |
Voltage - Supply |
1.65V~1.95V |
Terminal Position |
BOTTOM |
Terminal Form |
BALL |
Peak Reflow Temperature (Cel) |
225 |
Supply Voltage |
1.8V |
Time@Peak Reflow Temperature-Max (s) |
30 |
Base Part Number |
ZL50110 |
JESD-30 Code |
S-PBGA-B552 |
Function |
Telecom Circuit |
Qualification Status |
Not Qualified |
Interface |
TDM |
Number of Circuits |
1 |
Current - Supply |
950mA |
Height Seated (Max) |
2.53mm |
Length |
35mm |
Width |
35mm |
RoHS Status |
Non-RoHS Compliant |
ZL50110GAG Overview
552-BGA package is used to save board space.A Tray-packing method is used to pack telecommunications equipment.There is a type Surface Mount mount for this telecom circuit.There are 1 circuits in this telecom IC .The voltage supplied to 1.65V~1.95V can improve efficiency.Using -40°C~85°C as the operating temperature can result in reliable performance.Telecom switching configuration contains 552 terminations.There is a voltage supply called 1.8V that it uses.ZL50110 is the base part number, which can be used to find more related parts.950mA is the supply current.Other Telecom ICs includes telecommunications device as a subcategory.
ZL50110GAG Features
Available in the 552-BGA package
ZL50110GAG Applications
There are a lot of Microchip Technology ZL50110GAG Telecom applications.
- Cable Telephony
- Central office (CO)
- Integrated Access Devices (IADs)
- PBXs channel bank
- Inverse Multiplexing for ATM (IMA)
- Add/Drop multiplexers (ADMs)
- ATM equipment with integrated DS1 interfaces
- Integrated Access Devices
- Home Side Box
- High-Density T1/E1/J1 interfaces for Multiplexers