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ZL50110GAG

552 TerminationsZL50110 Telecom device1 Circuits


  • Manufacturer: Microchip Technology
  • Nocochips NO: 536-ZL50110GAG
  • Package: 552-BGA
  • Datasheet: PDF
  • Stock: 433
  • Description: 552 TerminationsZL50110 Telecom device1 Circuits(Kg)

Details

Tags

Parameters
Mounting Type Surface Mount
Package / Case 552-BGA
Surface Mount YES
Operating Temperature -40°C~85°C
Packaging Tray
Published 2009
JESD-609 Code e0
Pbfree Code no
Part Status Obsolete
Moisture Sensitivity Level (MSL) 3 (168 Hours)
Number of Terminations 552
Terminal Finish TIN LEAD
Subcategory Other Telecom ICs
Voltage - Supply 1.65V~1.95V
Terminal Position BOTTOM
Terminal Form BALL
Peak Reflow Temperature (Cel) 225
Supply Voltage 1.8V
Time@Peak Reflow Temperature-Max (s) 30
Base Part Number ZL50110
JESD-30 Code S-PBGA-B552
Function Telecom Circuit
Qualification Status Not Qualified
Interface TDM
Number of Circuits 1
Current - Supply 950mA
Height Seated (Max) 2.53mm
Length 35mm
Width 35mm
RoHS Status Non-RoHS Compliant

ZL50110GAG Overview


552-BGA package is used to save board space.A Tray-packing method is used to pack telecommunications equipment.There is a type Surface Mount mount for this telecom circuit.There are 1 circuits in this telecom IC .The voltage supplied to 1.65V~1.95V can improve efficiency.Using -40°C~85°C as the operating temperature can result in reliable performance.Telecom switching configuration contains 552 terminations.There is a voltage supply called 1.8V that it uses.ZL50110 is the base part number, which can be used to find more related parts.950mA is the supply current.Other Telecom ICs includes telecommunications device as a subcategory.

ZL50110GAG Features


Available in the 552-BGA package

ZL50110GAG Applications


There are a lot of Microchip Technology ZL50110GAG Telecom applications.

  • Cable Telephony
  • Central office (CO)
  • Integrated Access Devices (IADs)
  • PBXs channel bank
  • Inverse Multiplexing for ATM (IMA)
  • Add/Drop multiplexers (ADMs)
  • ATM equipment with integrated DS1 interfaces
  • Integrated Access Devices
  • Home Side Box
  • High-Density T1/E1/J1 interfaces for Multiplexers

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