Parameters | |
---|---|
Mounting Type | Surface Mount |
Package / Case | 552-BGA |
Surface Mount | YES |
Operating Temperature | -40°C~85°C |
Packaging | Tray |
JESD-609 Code | e0 |
Pbfree Code | no |
Part Status | Obsolete |
Moisture Sensitivity Level (MSL) | 3 (168 Hours) |
Number of Terminations | 552 |
Terminal Finish | TIN LEAD |
Subcategory | Other Telecom ICs |
Voltage - Supply | 1.65V~1.95V |
Terminal Position | BOTTOM |
Terminal Form | BALL |
Peak Reflow Temperature (Cel) | 225 |
Supply Voltage | 1.8V |
Time@Peak Reflow Temperature-Max (s) | 30 |
Base Part Number | ZL50114 |
JESD-30 Code | S-PBGA-B552 |
Function | Telecom Circuit |
Qualification Status | Not Qualified |
Interface | TDM |
Number of Circuits | 1 |
Current - Supply | 950mA |
Height Seated (Max) | 2.53mm |
Length | 35mm |
Width | 35mm |
RoHS Status | Non-RoHS Compliant |