Parameters | |
---|---|
Number of Pins | 3 |
Weight | 453.59237mg |
Power Dissipation | 850mW |
Turn On Delay Time | 8 ns |
Transistor Element Material | SILICON |
FET Type | N-Channel |
Manufacturer Package Identifier | E-Line |
Operating Temperature | -55°C~150°C TJ |
Rds On (Max) @ Id, Vgs | 500m Ω @ 3A, 10V |
Packaging | Bulk |
Published | 1997 |
Vgs(th) (Max) @ Id | 3V @ 1mA |
JESD-609 Code | e3 |
Input Capacitance (Ciss) (Max) @ Vds | 350pF @ 25V |
Pbfree Code | no |
Part Status | Active |
Current - Continuous Drain (Id) @ 25°C | 900mA Ta |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
Rise Time | 25ns |
ECCN Code | EAR99 |
Drive Voltage (Max Rds On,Min Rds On) | 5V 10V |
Vgs (Max) | ±20V |
Resistance | 500mOhm |
Fall Time (Typ) | 25 ns |
Terminal Finish | Matte Tin (Sn) |
Turn-Off Delay Time | 30 ns |
Continuous Drain Current (ID) | 900mA |
Subcategory | FET General Purpose Power |
Threshold Voltage | 3V |
Voltage - Rated DC | 100V |
Gate to Source Voltage (Vgs) | 20V |
Technology | MOSFET (Metal Oxide) |
Drain Current-Max (Abs) (ID) | 0.9A |
Terminal Position | BOTTOM |
Terminal Form | WIRE |
Drain to Source Breakdown Voltage | 100V |
Peak Reflow Temperature (Cel) | 260 |
Max Junction Temperature (Tj) | 150°C |
Current Rating | 900mA |
Height | 6.51mm |
Time@Peak Reflow Temperature-Max (s) | 40 |
Length | 4.77mm |
Width | 2.41mm |
Pin Count | 3 |
Radiation Hardening | No |
REACH SVHC | No SVHC |
Number of Elements | 1 |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |
Number of Channels | 1 |
Power Dissipation-Max | 850mW Ta |
Element Configuration | Single |
Factory Lead Time | 1 Week |
Operating Mode | ENHANCEMENT MODE |
Mount | Through Hole |
Mounting Type | Through Hole |
Package / Case | TO-226-3, TO-92-3 (TO-226AA) |