Parameters | |
---|---|
Factory Lead Time | 1 Week |
Mount | Through Hole |
Mounting Type | Through Hole |
Package / Case | TO-226-3, TO-92-3 (TO-226AA) |
Number of Pins | 3 |
Weight | 453.59237mg |
Transistor Element Material | SILICON |
Operating Temperature | -55°C~150°C TJ |
Packaging | Bulk |
Published | 2006 |
JESD-609 Code | e3 |
Pbfree Code | no |
Part Status | Active |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Number of Terminations | 3 |
ECCN Code | EAR99 |
Resistance | 9Ohm |
Terminal Finish | Matte Tin (Sn) |
Voltage - Rated DC | -240V |
Technology | MOSFET (Metal Oxide) |
Terminal Position | BOTTOM |
Terminal Form | WIRE |
Peak Reflow Temperature (Cel) | 260 |
Reach Compliance Code | not_compliant |
Current Rating | -200mA |
Time@Peak Reflow Temperature-Max (s) | 40 |
Pin Count | 3 |
Qualification Status | Not Qualified |
Number of Elements | 1 |
Number of Channels | 1 |
Power Dissipation-Max | 750mW Ta |
Element Configuration | Single |
Operating Mode | ENHANCEMENT MODE |
Power Dissipation | 750mW |
Turn On Delay Time | 8 ns |
FET Type | P-Channel |
Transistor Application | SWITCHING |
Rds On (Max) @ Id, Vgs | 9 Ω @ 200mA, 10V |
Vgs(th) (Max) @ Id | 2V @ 1mA |
Input Capacitance (Ciss) (Max) @ Vds | 200pF @ 25V |
Current - Continuous Drain (Id) @ 25°C | 200mA Ta |
Rise Time | 8ns |
Drain to Source Voltage (Vdss) | 240V |
Drive Voltage (Max Rds On,Min Rds On) | 3.5V 10V |
Vgs (Max) | ±40V |
Fall Time (Typ) | 8 ns |
Turn-Off Delay Time | 26 ns |
Continuous Drain Current (ID) | 200mA |
Threshold Voltage | -1.4V |
Gate to Source Voltage (Vgs) | 40V |
Drain Current-Max (Abs) (ID) | 0.2A |
Drain to Source Breakdown Voltage | -240V |
Height | 4.01mm |
Length | 4.77mm |
Width | 2.41mm |
REACH SVHC | No SVHC |
RoHS Status | ROHS3 Compliant |
Lead Free | Lead Free |